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| CYStech Electronics Corp. 100V/100mA SURFACE MOUNT SWITCHING DIODE Spec. No. : C332SN Issued Date : 2003.04.15 Revised Date : Page No. : 1/3 CDSS355A Features: Designed for mounting on small surface High speed switching High mounting capability, strong surge withstand, high reliability Mechanical data: Case: 0805(2012) Standard package, molded plastic Terminals : Solder plated, solderable per MIL-STD-750, method 2026. Polarity: Indicated by cathode band Mounting position: Any Weight: 4.8mg (approximately) Absolute Maximum Ratings(Ta=25) Characteristics Repetitive Peak Reverse Voltage Reverse Voltage Average Forward Current @ 8.3ms single half sinewave superimposed on rated load(JEDEC method) Peak Forward Surge Current @ single sinewave, 60Hz Power Dissipation Junction Temperature Storage Temperature Range Symbol VRRM VR IO IFSM PD Tj Tstg Value 110 100 100 1.0 300 -55 to +125 -55 to +125 Unit V V mA A mW C C Electrical Characteristics ( Tj=25C) Characteristics Forward Voltage at IF=100mA Reverse Leakage Current at VR=100V Diode Capacitance at VR = 1V Reverse Recovery Time From IF=-IR=10mA to IRR=-1mA, VR=6V, RL=50 Symbol VF IR CD trr Min Typ Max 1 100 3 4 Unit V nA pF ns CDSS355ASN CYStek Product Specification CYStech Electronics Corp. Characteristic Curves Spec. No. : C332SN Issued Date : 2003.04.15 Revised Date : Page No. : 2/3 Reverse Leakage Current vs Temperature Forward Current vs Forward Voltage 1000 Reverse Leakage Current---IR(nA) 10000 125 1000 75 100 25 10 Forward Current---IF(mA) 100 125 75 25 -25 10 1 0 0.2 0.4 0.6 0.8 1 1.2 Forward Voltage---VF(V) Diode Capacitance vs Reverse Voltage 5 1 0 10 20 30 40 50 60 70 80 Ambient Temperature---TA() Forward Current vs Ambient Temperature 125 Percentage of Peak Average Forward Current(%) Diode Capacitance---CD(pF) 4 3 2 1 0 0 2 4 6 8 f=1MHz Ta=25 Mounting on glass epoxy PCBs 100 75 50 25 0 10 12 14 0 25 50 75 100 125 150 Reverse Voltage---VR(V) Ambient Temperature---Ta() CDSS355ASN CYStek Product Specification CYStech Electronics Corp. 0805(2012) Dimension A B Spec. No. : C332SN Issued Date : 2003.04.15 Revised Date : Page No. : 3/3 R C D 0805 surface mount package CYStek package code:SN *:Typical DIM A B R Inches Min. Max. 0.079 0.087 0.016(typ.) 0.008(tup.) Millimeters Min. Max. 2.00 2.20 0.40(typ.) 0.20(typ.) DIM C D Inches Min. Max. 0.047 0.055 0.035 0.043 Millimeters Min. Max. 1.20 1.40 0.90 1.10 Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. * CYStek reserves the right to make changes to its products without notice. * CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. CDSS355ASN CYStek Product Specification |
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